About TEPC   
 
Founded:    October,1995 

Capital :     USD19,000,000         

 

Offer:       Special Packages 
                  Image Products 

Target:     To provide the best service to our customers 

 

Locations:  FOL+EOL1: Chu-Bei,Taiwan .
Focus:       QUALITY/COST/SPEED

                

 

                     

 

Milestones On Image

 
2006 ----- Developing tCam series up to 5 Mega to support  Auto& DSC applications
2005 ----- Developed tCam series  up to 2 Mega  to support MP & NB applications
2004 ----- Delivered over 12 million VGA CCM to tier 1 customers
 
2003 ----- tCSP CCM  Qualified by Tier 1 Customers
 
2002 ----- Mass production of the tCSP image sensor packaging & CCM
 
2001 ----- Developed and patented tCSP image sensor packaging
 
2000 ----- Mass production of the COB type Compact Camera Module (CCM)
 
1999 ----- Mass production of the CMOS image sensor packaging
 
1998 ----- Developed 1st  CMOS image sensor packaging in Taiwan & ISO9001
 
1995 ----- TEPC established